HTOL-E300
High-Temperature Operating Life
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage, and dynamic operation for a predefined period of time.
HAST-HA500
Highly Accelerate Temperature and Humidity Stress
It employs severe temperature, humidity, and bias conditions that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along with the interface between the external protective material and the metallic conductors that pass through it.
THB- CH800
Temperature Humidity bias (standard 85/85)
Some product failures are caused by moisture. It infiltrates into the product along with IC enclosure seals or gaps between pins that conduct metals within IC and result in a short circuit or current leak. The Temperature and Humidity test is designed to test the resistance of IC enclosures against moisture to assure product reliability.
EM-EM8020
Electromigration
Electromigration is the movement of atoms based on the flow of current through a material. If the current density is high enough, the heat dissipated within the material will repeatedly break atoms from the structure and move them. This will create both ‘vacancies’ and ‘deposits’. The vacancies can grow and eventually break circuit connections resulting in open-circuits, while the deposits can grow and eventually close circuit connections resulting in short-circuit.
HTGB/HTRB-GR600
HTGB(High-Temperature Gate Bias) / HTRB(High-Temperature Reverse Bias)
The system performs time-dependent breakdown evaluation of power semiconductor insulating film under high-temperature, high-voltage stress conditions.